Invention Grant
- Patent Title: Resin composition and film
- Patent Title (中): 树脂组成和膜
-
Application No.: US12280162Application Date: 2007-02-21
-
Publication No.: US07972680B2Publication Date: 2011-07-05
- Inventor: Kenichi Ueda , Shigeo Otome , Akio Naka
- Applicant: Kenichi Ueda , Shigeo Otome , Akio Naka
- Applicant Address: JP Osaka
- Assignee: Nippon Shokubai Co., Ltd.
- Current Assignee: Nippon Shokubai Co., Ltd.
- Current Assignee Address: JP Osaka
- Agency: Morrison & Foerster LLP
- Priority: JP2006-045950 20060222
- International Application: PCT/JP2007/053164 WO 20070221
- International Announcement: WO2007/099826 WO 20070907
- Main IPC: B32B27/30
- IPC: B32B27/30 ; C08L33/08 ; C08L33/20 ; C08L25/04

Abstract:
To realize a resin composition which enables formation of a film having excellent film formability and bending resistance and having a small retardation. A resin composition of the present invention comprises: an acrylic resin as a main component; and organic fine particles whose average particle diameter ranges from 0.01 μm to 1 μm, wherein a glass transition temperature of the acrylic resin ranges from 110° C. to 200° C., and each of the organic fine particles has a structural unit of a vinyl cyanide monomer and a structural unit of an aromatic vinyl monomer.
Public/Granted literature
- US20100168340A1 RESIN COMPOSITION AND FILM Public/Granted day:2010-07-01
Information query