Invention Grant
- Patent Title: Cu-Zn alloy strip superior in thermal peel resistance of Sn plating and Sn plating strip thereof
- Patent Title (中): Cu镀层的耐热剥离性优异的Cu-Zn合金带
-
Application No.: US12227765Application Date: 2007-05-28
-
Publication No.: US07972709B2Publication Date: 2011-07-05
- Inventor: Takaaki Hatano
- Applicant: Takaaki Hatano
- Applicant Address: JP Tokyo
- Assignee: JX Nippon Mining & Metals Co., Ltd.
- Current Assignee: JX Nippon Mining & Metals Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Drinker Biddle & Reath LLP
- Priority: JP2006-148597 20060529
- International Application: PCT/JP2007/060838 WO 20070528
- International Announcement: WO2007/139072 WO 20071206
- Main IPC: B32B15/01
- IPC: B32B15/01 ; B32B15/04 ; B32B15/20
Abstract:
A Cu—Zn alloy strip and Sn plating strip thereof having improved thermal peel resistance of Sn Plating is provided. In a Cu—Zn alloy strip comprising 15 to 40% by mass of Zn and a balance of Cu and unavoidable impurities, the total concentration of P, As, Sb and Bi is regulated to 100 ppm by mass or less, the total concentration of Ca and Mg is regulated to 100 ppm by mass or less, and the concentrations of O and S are each regulated to 30 ppm by mass or less.
Public/Granted literature
- US20090239094A1 Cu-Zn Alloy Strip Superior in Thermal Peel Resistance of Sn Plating and Sn Plating Strip Thereof Public/Granted day:2009-09-24
Information query
