Invention Grant
US07972711B2 Large area, uniformly low dislocation density GaN substrate and process for making the same 有权
大面积均匀低位错密度GaN衬底及其制造方法

  • Patent Title: Large area, uniformly low dislocation density GaN substrate and process for making the same
  • Patent Title (中): 大面积均匀低位错密度GaN衬底及其制造方法
  • Application No.: US12026552
    Application Date: 2008-02-05
  • Publication No.: US07972711B2
    Publication Date: 2011-07-05
  • Inventor: Xueping XuRobert P. Vaudo
  • Applicant: Xueping XuRobert P. Vaudo
  • Applicant Address: US NC Durham
  • Assignee: Cree, Inc.
  • Current Assignee: Cree, Inc.
  • Current Assignee Address: US NC Durham
  • Agency: Hultquist IP
  • Agent Vincent K. Gustafson
  • Main IPC: B32B9/00
  • IPC: B32B9/00
Large area, uniformly low dislocation density GaN substrate and process for making the same
Abstract:
Large area single crystal III-V nitride material having an area of at least 2 cm2, having a uniformly low dislocation density not exceeding 3×106 dislocations per cm2 of growth surface area, and including a plurality of distinct regions having elevated impurity concentration, wherein each distinct region has at least one dimension greater than 50 microns, is disclosed. Such material can be formed on a substrate by a process including (i) a first phase of growing the III-V nitride material on the substrate under pitted growth conditions, e.g., forming pits over at least 50% of the growth surface of the III-V nitride material, wherein the pit density on the growth surface is at least 102 pits/cm2 of the growth surface, and (ii) a second phase of growing the III-V nitride material under pit-filling conditions.
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