A method of the present invention is used for the high-rate deposition of materials, such as carbon, silicon, metals, metal oxides, and the like, onto a metal substrate defined by a metal current collector. The particles of the material are mixed with fluid and are injected against the metal tape at high pressure and high velocity. The particles of the material form an active layer of the metal current collector. The metal current collector is used as a cathode or anode combined with a separator to form a cell of a secondary battery, metal-ceramic membranes, film composite metal-ceramic materials for electronic devices.