Invention Grant
- Patent Title: Light emitting device and method of fabricating the same
- Patent Title (中): 发光元件及其制造方法
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Application No.: US10590325Application Date: 2005-02-25
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Publication No.: US07972892B2Publication Date: 2011-07-05
- Inventor: Masato Yamada , Masanobu Takahashi
- Applicant: Masato Yamada , Masanobu Takahashi
- Applicant Address: JP Tokyo
- Assignee: Shin-Etsu Handotai Co., Ltd.
- Current Assignee: Shin-Etsu Handotai Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Oliff & Berridge, PLC
- Priority: JP2004-052360 20040226
- International Application: PCT/JP2005/003133 WO 20050225
- International Announcement: WO2005/083806 WO 20050909
- Main IPC: H01L21/00
- IPC: H01L21/00

Abstract:
A composite growth-assisting substrate 10 is formed by epitaxially growing a separation-assisting compound semiconductor layer 10k composed of a non-GaAs III-V compound semiconductor single crystal, and then a sub-substrate 10e composed of a GaAs single crystal in this order, on a first main surface of a substrate bulk 10m composed of a GaAs single crystal. The sub-substrate portion 10e is then separated from the composite growth-assisting substrate 10, so as to be left as a residual substrate portion 1 on a second main surface of the main compound semiconductor layer 40, and a portion of the residual substrate portion 1 is cut off to thereby form a cut-off portion 1j having a bottom surface used as a light extraction surface. By this configuration, the light emitting device is provided as allowing effective use of the GaAs substrate, and increasing the light extraction efficiency.
Public/Granted literature
- US20070187712A1 Light emitting device and method of fabricating the same Public/Granted day:2007-08-16
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