Invention Grant
- Patent Title: Chip package sealing method
- Patent Title (中): 芯片封装封装方法
-
Application No.: US11105635Application Date: 2005-04-14
-
Publication No.: US07972901B2Publication Date: 2011-07-05
- Inventor: Brian Farrell , Paul Jaynes , Malcolm Taylor
- Applicant: Brian Farrell , Paul Jaynes , Malcolm Taylor
- Applicant Address: US MA Waltham
- Assignee: Foster-Miller, Inc.
- Current Assignee: Foster-Miller, Inc.
- Current Assignee Address: US MA Waltham
- Agency: Landiorio Teska & Coleman
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
A method of manufacturing a package including manufacturing a substrate to include at least one layer of LCP material, manufacturing a cover made of LCP material to include a lower lip, and sealing the cover to the substrate by heating the interface between the lower lip and the substrate.
Public/Granted literature
- US20050189332A1 Chip package sealing method Public/Granted day:2005-09-01
Information query
IPC分类:
