Invention Grant
US07972907B2 Via configurable architecture for customization of analog circuitry in a semiconductor device
有权
通过可配置的架构，用于定制半导体器件中的模拟电路
- Patent Title: Via configurable architecture for customization of analog circuitry in a semiconductor device
- Patent Title (中): 通过可配置的架构，用于定制半导体器件中的模拟电路
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Application No.: US12268919Application Date: 2008-11-11
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Publication No.: US07972907B2Publication Date: 2011-07-05
- Inventor: James C. Kemerling , David Ihme , William D. Cox
- Applicant: James C. Kemerling , David Ihme , William D. Cox
- Applicant Address: US NC Winston-Salam US NC Durham
- Assignee: Triad Semiconductor, Inc.,ViAsic, Inc.
- Current Assignee: Triad Semiconductor, Inc.,ViAsic, Inc.
- Current Assignee Address: US NC Winston-Salam US NC Durham
- Agency: Womble Carlyle
- Main IPC: H01L21/82
- IPC: H01L21/82
Abstract:
A semiconductor device having a plurality of layers and a plurality of circuit elements arranged in tiles. At least one of the plurality of layers in the semiconductor device may be a via layer configured to determine the connections of the plurality of circuit elements. The semiconductor device may include an interconnection quilt having a plurality of metal layers disposed to interconnect the plurality of circuit elements. The plurality of circuit elements may be analog circuit element and/or digital circuit elements. The tiles may be analog tiles and digital tiles that form a mixed signal structured array.
Public/Granted literature
- US20090061567A1 VIA CONFIGURABLE ARCHITECTURE FOR CUSTOMIZATION OF ANALOG CIRCUITRY IN A SEMICONDUCTOR DEVICE Public/Granted day:2009-03-05
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