Invention Grant
- Patent Title: Method for forming a Schottky diode
- Patent Title (中): 形成肖特基二极管的方法
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Application No.: US12474038Application Date: 2009-05-28
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Publication No.: US07972913B2Publication Date: 2011-07-05
- Inventor: Xin Lin , Daniel J. Blomberg , Jiang-Kai Zuo
- Applicant: Xin Lin , Daniel J. Blomberg , Jiang-Kai Zuo
- Applicant Address: US TX Austin
- Assignee: Freescale Semiconductor, Inc.
- Current Assignee: Freescale Semiconductor, Inc.
- Current Assignee Address: US TX Austin
- Agency: Ingrassia Fisher & Lorenz, P.C.
- Main IPC: H01L21/338
- IPC: H01L21/338

Abstract:
Improved Schottky diodes with reduced leakage current and improved breakdown voltage are provided by building a JFET with its current path of a first conductivity type serially located between a first terminal comprising a Schottky contact and a second terminal. The current path lies (i) between multiple substantially parallel finger regions of a second, opposite, conductivity type substantially laterally outboard of the Schottky contact, and (ii) partly above a buried region of the second conductivity type that underlies a portion of the current path, which regions are electrically coupled to the first terminal and the Schottky contact and which portion is electrically coupled to the second terminal. When reverse bias is applied to the first terminal and Schottky contact the current path is substantially pinched off in vertical or horizontal directions or both, thereby reducing the leakage current and improving the breakdown voltage of the device.
Public/Granted literature
- US20100301400A1 SCHOTTKY DIODE Public/Granted day:2010-12-02
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