Invention Grant
- Patent Title: Method for manufacturing semicondcutor device
- Patent Title (中): 制造半切割装置的方法
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Application No.: US12252455Application Date: 2008-10-16
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Publication No.: US07972929B2Publication Date: 2011-07-05
- Inventor: In-Kun Lee
- Applicant: In-Kun Lee
- Applicant Address: KR Seoul
- Assignee: Dongbu HiTek Co., Ltd.
- Current Assignee: Dongbu HiTek Co., Ltd.
- Current Assignee Address: KR Seoul
- Agency: Sherr & Vaughn, PLLC
- Priority: KR10-2007-0104444 20071017
- Main IPC: H01L21/8234
- IPC: H01L21/8234

Abstract:
A method for manufacturing a semiconductor device includes forming an ONO layer in a memory region and forming several gate oxide layer patterns in a logic region, a nitride layer in the logic region can be used as a hard mask, enabling a reduction in the number of masks used. This results in improved manufacturing efficiency and reduced manufacturing costs of a SONOS semiconductor device.
Public/Granted literature
- US20090104780A1 METHOD FOR MANUFACTURING SEMICONDCUTOR DEVICE Public/Granted day:2009-04-23
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