Invention Grant
- Patent Title: Pre-processed thermoplastic compound
- Patent Title (中): 预处理热塑性化合物
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Application No.: US12446015Application Date: 2007-10-19
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Publication No.: US07973099B2Publication Date: 2011-07-05
- Inventor: Hari Rajaraman
- Applicant: Hari Rajaraman
- Applicant Address: US OH Avon Lake
- Assignee: PolyOne Corporation
- Current Assignee: PolyOne Corporation
- Current Assignee Address: US OH Avon Lake
- Agent John H. Hornickel
- International Application: PCT/US2007/081902 WO 20071019
- International Announcement: WO2008/051828 WO 20080502
- Main IPC: C08K9/00
- IPC: C08K9/00 ; C09D151/00 ; B32B5/16

Abstract:
A pre-processed polymer composite is disclosed comprising a heat-sensitive polymer resin particle; particles of colorant or functional additive in association with the heat-sensitive polymer resin particle; and a thermoplastic encapsulant to form a film around the associated polymer and colorant or functional additive particles. The method of making the polymer composite avoids a melting of the heat-sensitive polymer resin particles, which avoids contributing to heat history of the polymer prior to extrusion or molding into the form of the final plastic article.
Public/Granted literature
- US20100280150A1 PRE-PROCESSED THERMOPLASTIC COMPOUND Public/Granted day:2010-11-04
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