Invention Grant
- Patent Title: Resin composition and resin molded object
- Patent Title (中): 树脂组合物和树脂成型体
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Application No.: US10580336Application Date: 2004-11-19
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Publication No.: US07973102B2Publication Date: 2011-07-05
- Inventor: Shun Takahashi , Motoki Takata
- Applicant: Shun Takahashi , Motoki Takata
- Applicant Address: JP Tokyo
- Assignee: Shiseido Company, Ltd.
- Current Assignee: Shiseido Company, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: IPUSA, PLLC
- Priority: JP2003-394176 20031125
- International Application: PCT/JP2004/017294 WO 20041119
- International Announcement: WO2005/052062 WO 20050609
- Main IPC: C08K5/56
- IPC: C08K5/56 ; C08K3/34

Abstract:
A resin composition which reduces hydrolysis thereof and reduces the color change thereof at the time of heating and a resin molded object which reduces hydrolysis thereof and reduces quality change of content therein are provided. The resin composition includes a resin and an organically modified layered silicate in which a substituted silyl group having a substituted or non-substituted alkyl group bonds to a layered silicate. The resin molded object is obtained by molding a resin composition including a resin and an organically modified layered silicate in which a substituted silyl group having a substituted or non-substituted alkyl group bonds to a layered silicate.
Public/Granted literature
- US20070093588A1 Resin composition and resin molded object Public/Granted day:2007-04-26
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