Invention Grant
- Patent Title: Ultrafine-coaxial-wire harness, connecting method thereof, circuit-board-connected body, circuit-board module, and electronic apparatus
- Patent Title (中): 超细同轴线束,其连接方法,电路板连接体,电路板模块和电子设备
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Application No.: US12282242Application Date: 2008-02-08
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Publication No.: US07973239B2Publication Date: 2011-07-05
- Inventor: Keiji Koyama , Hiroyuki Senba , Takayoshi Koinuma , Motoo Kobayashi
- Applicant: Keiji Koyama , Hiroyuki Senba , Takayoshi Koinuma , Motoo Kobayashi
- Applicant Address: JP Osaka
- Assignee: Sumitomo Electric Industries, Ltd.
- Current Assignee: Sumitomo Electric Industries, Ltd.
- Current Assignee Address: JP Osaka
- Agency: McDermott Will & Emery LLP
- Priority: JP2007-072515 20070320
- International Application: PCT/JP2008/052170 WO 20080208
- International Announcement: WO2008/082018 WO 20080710
- Main IPC: H02G15/02
- IPC: H02G15/02

Abstract:
A multicore ultrafine coaxial wire is formed by consolidating a plurality of ultrafine coaxial wires in a flat array. Each of the ultrafine coaxial wires has a center conductor, whose tip portion is exposed, an insulating layer, an outer conductor, and a covering. The harness has a grounding member that connects in common the outer conductors of the multicore ultrafine coaxial wire and an insulator frame that fixes the center conductors. End portions of an underside film and end portions of a topside film both of the insulator frame are provided with an alignment hole to align the center conductors with circuits on a substrate.
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