Invention Grant
- Patent Title: Printed circuit board
- Patent Title (中): 印刷电路板
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Application No.: US11765453Application Date: 2007-06-20
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Publication No.: US07973244B2Publication Date: 2011-07-05
- Inventor: Yu-Hsu Lin , Chan-Fei Tai , Jeng-Da Wu , Chih-Hang Chao
- Applicant: Yu-Hsu Lin , Chan-Fei Tai , Jeng-Da Wu , Chih-Hang Chao
- Applicant Address: TW Tu-Cheng, New Taipei
- Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: TW Tu-Cheng, New Taipei
- Agent Frank R. Niranjan
- Priority: CN200710200165 20070207
- Main IPC: H05K1/03
- IPC: H05K1/03
Abstract:
A printed circuit board includes a base formed from a plurality of woven fibers, and signal traces laid on the base. Each of the signal traces includes at least a straight line segment. The signal traces are laid on the base in such a manner that the line segments of the signal traces mapped on the base cross the fibers at angles not equal to zero degrees.
Public/Granted literature
- US20080186687A1 PRINTED CIRCUIT BOARD Public/Granted day:2008-08-07
Information query
