Invention Grant
US07973274B2 Tactile sensor module with a flexible substrate adapted for use on a curved surface and method of a mounting tactile sensor
有权
具有适用于弯曲表面的柔性基板的触觉传感器模块和安装触觉传感器的方法
- Patent Title: Tactile sensor module with a flexible substrate adapted for use on a curved surface and method of a mounting tactile sensor
- Patent Title (中): 具有适用于弯曲表面的柔性基板的触觉传感器模块和安装触觉传感器的方法
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Application No.: US12065966Application Date: 2006-09-05
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Publication No.: US07973274B2Publication Date: 2011-07-05
- Inventor: Yasuo Kuniyoshi , Yoshiyuki Ohmura , Naoko Seta , Akihiko Nagakubo
- Applicant: Yasuo Kuniyoshi , Yoshiyuki Ohmura , Naoko Seta , Akihiko Nagakubo
- Applicant Address: JP Tokyo JP Tokyo
- Assignee: The University of Tokyo,National Institute Of Advanced Industrial Science And Technology
- Current Assignee: The University of Tokyo,National Institute Of Advanced Industrial Science And Technology
- Current Assignee Address: JP Tokyo JP Tokyo
- Agency: Ladas & Parry, LLP
- Priority: JP2005-263325 20050912
- International Application: PCT/JP2006/317541 WO 20060905
- International Announcement: WO2007/032227 WO 20070322
- Main IPC: G01J1/56
- IPC: G01J1/56

Abstract:
The invention provides a tactile sensor module that enables adjustment of the density of sensing elements and adjustment of mounting regions to be carried out in a straightforward manner with one type of module that is highly adaptive to complex curved surfaces. A tactile sensor module comprises a flexible substrate having one or a plurality of strips, a plurality of sensing elements arranged at the one or plurality of strips of the flexible substrate, one or more communication terminals provided at the flexible substrate; and at least one electronic circuit section provided at the flexible substrate having communication functions. At least one of the strips comprises a foldable region and/or a cuttable region.
Public/Granted literature
- US20090134318A1 TACTILE SENSOR MODULE AND METHOD OF MOUNTING TACTILE SENSOR Public/Granted day:2009-05-28
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