Invention Grant
- Patent Title: Schottky barrier diode and method for making the same
- Patent Title (中): 肖特基势垒二极管及其制造方法
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Application No.: US11975366Application Date: 2007-10-18
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Publication No.: US07973318B2Publication Date: 2011-07-05
- Inventor: Shingo Ohta , Tatsuya Kiriyama , Takashi Nakamura , Yuji Okamura
- Applicant: Shingo Ohta , Tatsuya Kiriyama , Takashi Nakamura , Yuji Okamura
- Applicant Address: JP Kyoto
- Assignee: Rohm Co., Ltd.
- Current Assignee: Rohm Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Hamre, Schumann, Mueller & Larson, P.C.
- Priority: JP2006-283253 20061018
- Main IPC: H01L29/24
- IPC: H01L29/24

Abstract:
A schottky diode includes a SiC substrate which has a first surface and a second surface facing away from the first surface, a semiconductor layer which is formed on the first surface of the SiC substrate, a schottky electrode which is in contact with the semiconductor layer, and an ohmic electrode which is in contact with the second surface of the SiC substrate. The first surface of the SiC substrate is a (000-1) C surface, upon which the semiconductor layer is formed.
Public/Granted literature
- US20090001382A1 Schottky barrier diode and method for making the same Public/Granted day:2009-01-01
Information query
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