Invention Grant
- Patent Title: Semiconductor component and method for producing it
- Patent Title (中): 半导体元件及其制造方法
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Application No.: US11866662Application Date: 2007-10-03
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Publication No.: US07973362B2Publication Date: 2011-07-05
- Inventor: Armin Willmeroth , Michael Rueb , Carolin Tolksdorf , Markus Schmitt
- Applicant: Armin Willmeroth , Michael Rueb , Carolin Tolksdorf , Markus Schmitt
- Applicant Address: AT Villach
- Assignee: Infineon Technologies Austria AG
- Current Assignee: Infineon Technologies Austria AG
- Current Assignee Address: AT Villach
- Agency: Dicke, Billig & Czaja, PLLC
- Priority: DE102006047489 20061005
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L27/088

Abstract:
A semiconductor component includes a semiconductor body having an edge with an edge zone of a first conductivity type. Charge compensation regions of a second conductivity type are embedded into the edge zone, with the charge compensation regions extending from a top side of the semiconductor component vertically into the semiconductor body. For the number Ns of charge carriers present in a volume Vs between two charge compensation regions that are adjacent in a direction perpendicular to the edge, and for the number Np of charge carriers present in a volume Vp between two charge compensation regions that are adjacent in a direction parallel to the edge, Np>Ns holds true.
Public/Granted literature
- US20080237701A1 SEMICONDUCTOR COMPONENT AND METHOD FOR PRODUCING IT Public/Granted day:2008-10-02
Information query
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