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Invention Grant
US07973380B2 Method for providing metal extension in backside illuminated sensor for wafer level testing 有权
用于在背面照明传感器中提供金属延伸用于晶片级测试的方法

Method for providing metal extension in backside illuminated sensor for wafer level testing
Abstract:
A method of providing metal extension in a backside illuminated image sensor is provided in the present disclosure. In one embodiment, a first set of pads and a second set of pads, and a metal layer are provided in a backside illuminated image sensor. The first set of pads are electrically coupled to the second set of pads through the metal layer, and a pad in the second set of pads is exposed to the surface of the backside illuminated image sensor for testing. In an alternative embodiment, a first set of pads, at least one second pad directly positioned over the first set of pads are provided in a backside illuminated image sensor. The first set of pads are electrically coupled to the at least one second pad and the at least one second pad is exposed to the surface of the backside illuminated image sensor for testing.
Abstract(Chinese):

在本公开中提供了在背面照明图像传感器中提供金属延伸的方法。 在一个实施例中，第一组焊盘和第二组焊盘以及金属层设置在背面照明的图像传感器中。 第一组焊盘通过金属层电耦合到第二组焊盘，并且第二组焊盘中的焊盘暴露于背面照射的图像传感器的表面用于测试。 在替代实施例中，第一组焊盘，至少一个第二焊盘，直接位于第一组焊盘上方，设置在背面照明的图像传感器中。 第一组焊盘电耦合到至少一个第二焊盘，并且至少一个第二焊盘暴露于背面照射的图像传感器的表面用于测试。

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