Invention Grant
- Patent Title: Tapered dielectric and conductor structures and applications thereof
- Patent Title (中): 锥形电介质和导体结构及其应用
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Application No.: US12128620Application Date: 2008-05-29
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Publication No.: US07973391B2Publication Date: 2011-07-05
- Inventor: Joseph C. Fjelstad , Kevin P. Grundy , Para K. Segaram , Gary Yasumura
- Applicant: Joseph C. Fjelstad , Kevin P. Grundy , Para K. Segaram , Gary Yasumura
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Myers Bigel Sibley & Sajovec, P.A.
- Main IPC: H01L23/58
- IPC: H01L23/58
Abstract:
Disclosed are tapered dielectric and conductor structures which provide controlled impedance interconnection while signal conductor lines transition from finer pitches to coarser pitches thereby obviating electrical discontinuities generally associated with changes of circuit contact pitch. Also disclosed are methods for the construction of the devices and applications therefore.
Public/Granted literature
- US20090027137A1 TAPERED DIELECTRIC AND CONDUCTOR STRUCTURES AND APPLICATIONS THEREOF Public/Granted day:2009-01-29
Information query
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