Invention Grant
- Patent Title: Stacked micro optocouplers and methods of making the same
- Patent Title (中): 堆叠式微光耦合器及其制作方法
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Application No.: US12365793Application Date: 2009-02-04
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Publication No.: US07973393B2Publication Date: 2011-07-05
- Inventor: Yong Liu , Yumin Liu
- Applicant: Yong Liu , Yumin Liu
- Applicant Address: US ME South Portland
- Assignee: Fairchild Semiconductor Corporation
- Current Assignee: Fairchild Semiconductor Corporation
- Current Assignee Address: US ME South Portland
- Agency: Kilpatrick Townsend & Stockton LLP
- Main IPC: H01L39/00
- IPC: H01L39/00

Abstract:
Disclosed are packages for optocouplers and methods of making the same. An exemplary optocoupler comprises a substrate having a first surface and a second surface, a plurality of optoelectronic dice for one or more optocouplers disposed on the substrate's first surface, and a plurality of optoelectronic dice for one or more optocouplers disposed on the substrate's second surface. The substrate may comprise a pre-molded leadframe, and electrical connections between optoelectronic dice on opposite surfaces of the substrate may be made via one or more leads of the leadframe.
Public/Granted literature
- US20100193803A1 Stacked Micro Optocouplers and Methods of Making the Same Public/Granted day:2010-08-05
Information query
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