Invention Grant
- Patent Title: Enhanced integrated circuit package
- Patent Title (中): 增强型集成电路封装
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Application No.: US12511077Application Date: 2009-07-29
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Publication No.: US07973394B2Publication Date: 2011-07-05
- Inventor: Tung Lok Li
- Applicant: Tung Lok Li
- Applicant Address: CN Hong Kong SAR
- Assignee: Blondwich Limited
- Current Assignee: Blondwich Limited
- Current Assignee Address: CN Hong Kong SAR
- Agency: Eagle IP Limited
- Agent Jacqueline C. Lui
- Main IPC: H01L23/495
- IPC: H01L23/495
Abstract:
A semiconductor including a selectively plated lead frame is disclosed. The lead frame contains a die pad and a plurality of lead fingers, where each lead finger is formed with a bonding pad on the center portion of the lead finger by selective plating. The surface area of the lead finger material is increased so the adhesion to molding material is improved. The edges of the lead finger tips are half etched to further increase the surface area of lead finger material. A method of manufacturing the lead frame is also provided.
Public/Granted literature
- US20100314732A1 ENHANCED INTEGRATED CIRCUIT PACKAGE Public/Granted day:2010-12-16
Information query
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