An embedded chip package structure is proposed. The embedded chip package structure includes a supporting board with a protruding section, a semiconductor chip formed on the protruding section of the supporting board, a dielectric layer formed on the supporting board and the semiconductor chip, and a circuit layer formed on the dielectric layer. The circuit layer is electrically connected to electrode pads of the semiconductor chip via a plurality of conducting structures formed inside the dielectric layer such that the semiconductor chip can be electrically connected to an external element through the circuit layer. By varying the thicknesses of the protruding section, the dielectric layer and the supporting board, warpage of the package structure resulted from temperature change during the fabrication process can be prevented.