Invention Grant
US07973403B2 Adhesive sheet for light-emitting diode device and light-emitting diode device
有权
发光二极管器件和发光二极管器件用粘合片
- Patent Title: Adhesive sheet for light-emitting diode device and light-emitting diode device
- Patent Title (中): 发光二极管器件和发光二极管器件用粘合片
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Application No.: US12624759Application Date: 2009-11-24
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Publication No.: US07973403B2Publication Date: 2011-07-05
- Inventor: Koji Itoh , Shigeyoshi Ishii
- Applicant: Koji Itoh , Shigeyoshi Ishii
- Applicant Address: US MN Saint Paul
- Assignee: 3M Innovative Properties Company
- Current Assignee: 3M Innovative Properties Company
- Current Assignee Address: US MN Saint Paul
- Priority: JP2004-025723 20040202
- Main IPC: H01L21/44
- IPC: H01L21/44

Abstract:
[Problem] To provide an adhesive sheet which is used for a light-emitting diode device, and which is free from cracks and peeling off of the adhered portions.[Means for Solving the Problem] An adhesive sheet for a light-emitting diode device, which comprises a thermoplastic polymer containing epoxy groups and a compound containing functional groups which are addition reactive with the epoxy groups or a polymerization catalyst which can effect a ring opening polymerization of the epoxy groups, and in which said thermoplastic polymer is cross-linked so that its flowability is restrained.
Public/Granted literature
- US20100065878A1 ADHESIVE SHEET FOR LIGHT-EMITTING DIODE DEVICE AND LIGHT-EMITTING DIODE DEVICE Public/Granted day:2010-03-18
Information query
IPC分类: