An electromotive cooling head includes a substrate, an N-pole magnet, and an S-pole magnet, and kept in intimate contact with the backside of the semiconductor integrated circuit so as to cover it. The substrate has a fluid channel having a micro-channel structure, through which a conductive fluid flows. An anode and a cathode are disposed to sandwich the fluid channel. The conductive fluid interacts with a magnetic field to thereby induce an electromotive force between the anode and the cathode. A circuit includes, on its backside, a power supply voltage terminal and a ground terminal, and is driven by the electromotive force induced in the electromotive cooling head.