Invention Grant
US07973547B2 Method and apparatus for detecting a crack in a semiconductor wafer, and a wafer chuck
有权
用于检测半导体晶片中的裂纹的方法和装置以及晶片卡盘
- Patent Title: Method and apparatus for detecting a crack in a semiconductor wafer, and a wafer chuck
- Patent Title (中): 用于检测半导体晶片中的裂纹的方法和装置以及晶片卡盘
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Application No.: US12190745Application Date: 2008-08-13
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Publication No.: US07973547B2Publication Date: 2011-07-05
- Inventor: Alois Nitsch , Rainer Tilgner , Horst Baumeister
- Applicant: Alois Nitsch , Rainer Tilgner , Horst Baumeister
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Slater & Matsil, L.L.P.
- Main IPC: G01R31/308
- IPC: G01R31/308
Abstract:
A method for detecting a crack in a semiconductor wafer, which includes an electrical device and a connecting pad electrically coupled with the electrical device, is described. The crack is detected by an acoustic detector being acoustically coupled to the semiconductor wafer during contacting the contacting pad with a probe.
Public/Granted literature
- US20100039128A1 Method and Apparatus for Detecting a Crack in a Semiconductor Wafer, and a Wafer Chuck Public/Granted day:2010-02-18
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