Invention Grant
US07973550B2 Semiconductor device test apparatus including interface unit and method of testing semiconductor device using the same
有权
包括接口单元的半导体器件测试装置和使用其的半导体器件的测试方法
- Patent Title: Semiconductor device test apparatus including interface unit and method of testing semiconductor device using the same
- Patent Title (中): 包括接口单元的半导体器件测试装置和使用其的半导体器件的测试方法
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Application No.: US12582980Application Date: 2009-10-21
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Publication No.: US07973550B2Publication Date: 2011-07-05
- Inventor: Eun-Jo Byun , Sang-Hoon Lee , Se-Jang Oh , Cheol-Jong Woo
- Applicant: Eun-Jo Byun , Sang-Hoon Lee , Se-Jang Oh , Cheol-Jong Woo
- Applicant Address: KR Suwon-Si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-Si
- Agency: F. Chau & Associates, LLC
- Priority: KR10-2009-0004645 20090120
- Main IPC: G01R31/02
- IPC: G01R31/02 ; G01R31/26

Abstract:
A semiconductor device test apparatus is provided. The semiconductor device test apparatus includes a test unit on which a semiconductor device under test is disposed, and an automatic test equipment (ATE) unit that inputs a test signal to the test unit and reads a test result signal output by the test unit. The semiconductor device test apparatus includes an interface unit that is interposed between the test unit and the ATE unit, and that compares the test signal with the test result signal and outputs to the ATE unit comparison signals indicating whether the semiconductor device is a failure or not or whether a specific bit failure has occurred or not.
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