A semiconductor package includes an insulating substrate configured to be provided for mounting a semiconductor chip which processes a signal with a frequency in a radio frequency band. The insulating substrate includes a first external connecting electrode, a second external connecting electrode, and a partial antenna wiring. The first external connecting electrode and the second external connecting electrode are connected with the partial antenna wiring. Each of the first external connecting electrode and the second external connecting electrode is an electrode to be connected with an external antenna pattern.