Invention Grant
- Patent Title: Chip antenna apparatus and methods
- Patent Title (中): 芯片天线装置及方法
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Application No.: US12661394Application Date: 2010-03-15
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Publication No.: US07973720B2Publication Date: 2011-07-05
- Inventor: Juha Sorvala
- Applicant: Juha Sorvala
- Applicant Address: FI Kempele
- Assignee: LKP Pulse Finland OY
- Current Assignee: LKP Pulse Finland OY
- Current Assignee Address: FI Kempele
- Agency: Gazdzinski & Associates, PC
- Priority: FI20040892 20040628
- Main IPC: H01Q1/38
- IPC: H01Q1/38

Abstract:
A chip component with dielectric substrate and plurality of radiating antenna elements on the surface thereof. In one embodiment, two (2) substantially symmetric elements are used, each covering an opposite head and upper surface portion of the device. The surface between the elements comprises a slot. The chip is mounted on a circuit board (e.g., PCB) whose conductor pattern is part of the antenna. No ground plane is used under the chip or its sides to a certain distance. One of the antenna elements is coupled to the feed conductor on the PCB and to the ground plane, while the parasitic element is coupled only to the ground plane. The parasitic element is fed through coupling over the slot, and both elements resonate at the operating frequency. The antenna can be tuned and matched without discrete components, is substantially omni-directional, and has low substrate losses due to simple field image.
Public/Granted literature
- US20100176998A1 Chip antenna apparatus and methods Public/Granted day:2010-07-15
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