Invention Grant
- Patent Title: Inductive and capacitive components integration structure
- Patent Title (中): 感性和电容元件集成结构
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Application No.: US12260447Application Date: 2008-10-29
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Publication No.: US07974069B2Publication Date: 2011-07-05
- Inventor: Saijun Mao , Yingqi Zhang , Xiaoming Yuan
- Applicant: Saijun Mao , Yingqi Zhang , Xiaoming Yuan
- Applicant Address: US NY Niskayuna
- Assignee: General Electric Company
- Current Assignee: General Electric Company
- Current Assignee Address: US NY Niskayuna
- Agent Jason K. Klindworth
- Main IPC: H01H9/28
- IPC: H01H9/28 ; H01H27/00 ; H01H47/00 ; H01H63/00

Abstract:
An inductive and capacitive components integration structure includes a magnetic core including a first and a second outer leg, and a third inner leg between the first and second outer legs, a first and a second winding respectively wound on the first and second outer legs, and a third winding wound on the third inner leg. The first and second windings are electrically coupled and comprise a first inductive winding. The first inductive winding does not generate any effective magnetic flux through the third inner leg. The third winding forms a second inductive winding. At least one of the first, second and third windings is a composite winding and comprises at least one embedded capacitor.
Public/Granted literature
- US20100103585A1 INDUCTIVE AND CAPACITIVE COMPONENTS INTEGRATION STRUCTURE Public/Granted day:2010-04-29
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