Invention Grant
- Patent Title: Multilayer capacitor
- Patent Title (中): 多层电容器
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Application No.: US11898594Application Date: 2007-09-13
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Publication No.: US07974071B2Publication Date: 2011-07-05
- Inventor: Masaaki Togashi
- Applicant: Masaaki Togashi
- Applicant Address: JP Tokyo
- Assignee: TDK Corporation
- Current Assignee: TDK Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oliff & Berridge, PLC
- Priority: JP2006-259798 20060925
- Main IPC: H01G4/005
- IPC: H01G4/005 ; H01G4/06 ; H01G4/20

Abstract:
A multilayer capacitor includes a dielectric body 12 formed by stacking a plurality of dielectric layers 12a; a first internal conductor layer 21 led out straddling three side faces 12A, 12C and 12D of said dielectric body 12; a second internal conductor layer 22, stacked in the dielectric body 12 via dielectric layers 12a to the first internal conductor layer 21, led out straddling three side faces 12B, 12C and 12D; a first and a second terminal electrodes 31 and 32 formed on an outer face of said dielectric body 12, straddling the three side faces 12A, 12C and 12D, and 12B, and 12C and 12D, respectively. A first space pattern 41 is formed on the first lead portion at a position along with the first side face 12A, not connected with the first terminal electrode 31.
Public/Granted literature
- US20080074825A1 Multilayer capacitor Public/Granted day:2008-03-27
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