Invention Grant
- Patent Title: Printed circuit board and heat sink
- Patent Title (中): 印刷电路板和散热片
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Application No.: US12485929Application Date: 2009-06-17
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Publication No.: US07974097B2Publication Date: 2011-07-05
- Inventor: Yung-Chou Li
- Applicant: Yung-Chou Li
- Applicant Address: CN Guangzhou TW Taipei
- Assignee: Silitek Electronic (Guangzhou) Co., Ltd.,Lite-On Technology Corp.
- Current Assignee: Silitek Electronic (Guangzhou) Co., Ltd.,Lite-On Technology Corp.
- Current Assignee Address: CN Guangzhou TW Taipei
- Priority: CN200810218662 20081023
- Main IPC: H05K7/20
- IPC: H05K7/20 ; F28F7/00 ; H01L23/34
Abstract:
A heat sink for a printed circuit board of power server includes at least one soldering portion. The heat sink is soldered to the printed circuit board at the soldering portion by a lead-free tin soldering process. A plurality of protruding structures protrudes from the soldering portion uniformly. The protruding structures are beneficial for getting a better soldering quality.
Public/Granted literature
- US20100103625A1 PRINTED CIRCUIT BOARD AND HEAT SINK Public/Granted day:2010-04-29
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