Invention Grant
- Patent Title: Printed wiring board and connection configuration of the same
- Patent Title (中): 印刷电路板和连接配置相同
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Application No.: US12577867Application Date: 2009-10-13
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Publication No.: US07974104B2Publication Date: 2011-07-05
- Inventor: Tomofumi Kitada , Hiroki Maruo
- Applicant: Tomofumi Kitada , Hiroki Maruo
- Applicant Address: JP Tokyo
- Assignee: Fujikura Ltd.
- Current Assignee: Fujikura Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2006-040894 20060217
- Main IPC: H05K7/00
- IPC: H05K7/00

Abstract:
A printed wiring board having an insulating base material; a wiring formed on at least one surface of the insulating base material, the wiring forming a predetermined circuit pattern; a first connection terminal portion formed on the surface and electrically connected to the wiring, the first connection terminal portion having a first width; a second connection terminal portion formed on the surface and electrically connected to the wiring, the second connection terminal portion having a second width; and a cover layer configured to cover the wiring and expose the first and the second connection terminal portion.
Public/Granted literature
- US20100027229A1 PRINTED WIRING BOARD AND CONNECTION CONFIGURATION OF THE SAME Public/Granted day:2010-02-04
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