Invention Grant
- Patent Title: Wordline temperature compensation
- Patent Title (中): 字线温度补偿
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Application No.: US12339935Application Date: 2008-12-19
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Publication No.: US07974146B2Publication Date: 2011-07-05
- Inventor: Gerald J Barkley
- Applicant: Gerald J Barkley
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: LeMoine Patent Services, PLLC
- Agent Dana B. LeMoine
- Main IPC: G11C8/00
- IPC: G11C8/00
Abstract:
A nonvolatile memory includes a temperature dependent read window. One or more temperature compensated wordline voltage supply circuits provide temperature compensated wordline signal(s) to the nonvolatile memory. The temperature compensated wordline signals change as the temperature dependent read window changes.
Public/Granted literature
- US20100157672A1 Wordline Temperature Compensation Public/Granted day:2010-06-24
Information query
