Invention Grant
- Patent Title: Lead body constructions for implantable medical electrical leads
- Patent Title (中): 用于植入式医用电线的引线体结构
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Application No.: US11843021Application Date: 2007-08-22
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Publication No.: US07974704B2Publication Date: 2011-07-05
- Inventor: James A. Alexander , Loren S. Chapeau
- Applicant: James A. Alexander , Loren S. Chapeau
- Applicant Address: US MN Minneapolis
- Assignee: Medtronic, Inc.
- Current Assignee: Medtronic, Inc.
- Current Assignee Address: US MN Minneapolis
- Main IPC: A61N1/05
- IPC: A61N1/05

Abstract:
A lead body of an implantable medical electrical lead includes a first filler and a second filler, each extending within a proximal portion thereof. The first filler may have a stiffness that is less than that of the second filler, and may surround and isolate a plurality of conductors which are coupled to a connector terminal of the lead, which connector terminal extends proximally from a proximal end of the lead body. The second filler extends along a limited length, alongside the first filler, wherein the limited length extends distally from the connector terminal; the second filler may further extend into the connector terminal.
Public/Granted literature
- US20090054949A1 LEAD BODY CONSTRUCTIONS FOR IMPLANTABLE MEDICAL ELECTRICAL LEADS Public/Granted day:2009-02-26
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