Invention Grant
- Patent Title: MEEF reduction by elongation of square shapes
- Patent Title (中): 通过平方形延伸的MEEF减小
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Application No.: US12191493Application Date: 2008-08-14
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Publication No.: US07975246B2Publication Date: 2011-07-05
- Inventor: Derren Neylon Dunn , Michael M Crouse , Henning Haffner , Michael Edward Scaman
- Applicant: Derren Neylon Dunn , Michael M Crouse , Henning Haffner , Michael Edward Scaman
- Applicant Address: US NY Armonk US CA Milpitas
- Assignee: International Business Machines Corporation,Infineon Technologies North America Corporation
- Current Assignee: International Business Machines Corporation,Infineon Technologies North America Corporation
- Current Assignee Address: US NY Armonk US CA Milpitas
- Agency: Hoffman Warnick LLC
- Agent Yuanmin Cai
- Main IPC: G06F17/50
- IPC: G06F17/50 ; G06F19/00 ; G03F1/00 ; G21K5/00
Abstract:
A method that purposely relaxes OPC algorithm constraints to allow post OPC mask shapes to elongate along one direction (particularly lowering the 1-dimensional MEEF in this direction with the result of an effectively overall lowered MEEF) to produce a pattern on wafer that is circular to within an acceptable tolerance.
Public/Granted literature
- US20100042967A1 MEEF REDUCTION BY ELONGATION OF SQUARE SHAPES Public/Granted day:2010-02-18
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