Invention Grant
- Patent Title: Acoustic diaphragm, and method of fabricating acoustic diaphragm
- Patent Title (中): 声膜,以及制造声膜的方法
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Application No.: US11561690Application Date: 2006-11-20
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Publication No.: US07980355B2Publication Date: 2011-07-19
- Inventor: Kunihiko Tokura , Masaru Uryu , Toru Takebe
- Applicant: Kunihiko Tokura , Masaru Uryu , Toru Takebe
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2005-337454 20051122
- Main IPC: H04R7/00
- IPC: H04R7/00 ; H04R1/00

Abstract:
There is provided an acoustic diaphragm used for a loudspeaker, having an injection-molded edge molded using a thermoplastic elastomer, in which the edge is formed using a workable polyolefinic elastomer, as a material, containing a soft segment having rubber particles of 1 μm to 10 μm in diameter uniformly dispersed therein, and a hard segment composed of an olefinic resin, and the edge is formed into a shape allowing the resin to be aligned as being not causative of anisotropy in the physical characteristics of the edge, as a result of thin-wall molding by the injection molding.
Public/Granted literature
- US20070133838A1 ACOUSTIC DIAPHRAGM, AND METHOD OF FABRICATING ACOUSTIC DIAPHRAGM Public/Granted day:2007-06-14
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