Invention Grant
- Patent Title: Method of shot peening coil springs
- Patent Title (中): 喷丸硬化螺旋弹簧的方法
-
Application No.: US11680852Application Date: 2007-03-01
-
Publication No.: US07984537B2Publication Date: 2011-07-26
- Inventor: Jack Champaigne
- Applicant: Jack Champaigne
- Applicant Address: US IN Mishawaka
- Assignee: Electronics Inc.
- Current Assignee: Electronics Inc.
- Current Assignee Address: US IN Mishawaka
- Agency: Botkin & Hall, LLP
- Main IPC: B21C37/30
- IPC: B21C37/30

Abstract:
Both the inner and outer circumferential surfaces of a coil spring are peened by passing sequential segments of the spring around offset pulleys mounted within a peening cabinet. As the spring is pulled around one of the pulleys, the coils fan out from the pulley to permit the peening media to impact portions of the inner and outer circumferential surfaces of the spring, and as the spring is pulled around the other pulley, the portions of the surfaces not peened as the segment traveled around the first pulley will be peened.
Public/Granted literature
- US20080209731A1 METHOD OF SHOT PEENING COIL SPRINGS Public/Granted day:2008-09-04
Information query