Invention Grant
- Patent Title: Methods for moving a substrate carrier
- Patent Title (中): 移动衬底载体的方法
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Application No.: US12359310Application Date: 2009-01-24
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Publication No.: US07984543B2Publication Date: 2011-07-26
- Inventor: Martin R. Elliott , Vinay K. Shah , Eric A. Englhardt , Jeffrey C. Hudgens
- Applicant: Martin R. Elliott , Vinay K. Shah , Eric A. Englhardt , Jeffrey C. Hudgens
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Dugan & Dugan, P.C.
- Main IPC: B23P23/00
- IPC: B23P23/00
Abstract:
Systems, methods, and apparatus are provided for electronic device manufacturing. The invention includes removing a first substrate carrier and a second substrate carrier from a moving conveyor using an end effector assembly and concurrently transferring the first and second substrate carriers from the moving conveyor to a support location via the end effector assembly. Numerous other aspects are provided.
Public/Granted literature
- US20090188103A1 METHODS AND APPARATUS FOR MOVING A SUBSTRATE CARRIER Public/Granted day:2009-07-30
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