Invention Grant
- Patent Title: Approaches for manufacturing a head gimbal assembly
- Patent Title (中): 头部万向节组件的制造方法
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Application No.: US12220746Application Date: 2008-07-25
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Publication No.: US07984545B2Publication Date: 2011-07-26
- Inventor: Yuhsuke Matsumoto , Tatsumi Tsuchiya , Hideto Imai , Tamaki Ushimoto
- Applicant: Yuhsuke Matsumoto , Tatsumi Tsuchiya , Hideto Imai , Tamaki Ushimoto
- Applicant Address: NL Amsterdam
- Assignee: Hitachi Global Storage Technologies Netherlands B.V.
- Current Assignee: Hitachi Global Storage Technologies Netherlands B.V.
- Current Assignee Address: NL Amsterdam
- Agency: Mahamedi Paradice Kreisman LLP
- Agent Christopher J. Brokaw
- Priority: JP2007-195437 20070727
- Main IPC: G11B5/127
- IPC: G11B5/127 ; H04R31/00

Abstract:
Approaches for helping to decrease the amount of inactive gas necessary for reflow to interconnect connection terminals of a head slider and a suspension. Inactive gas is blown from a nozzle of a reflow apparatus toward interconnection joints of a head slider and a suspension. The head slider is bonded onto a gimbal tongue. The nozzle comprises a duct through which the inactive gas passes and a porous member fitted in an ejection outlet of the tube. Placing the porous member close to the head slider achieves effective reduction of oxygen concentration around solder balls.
Public/Granted literature
- US20090025205A1 Method and apparatus for manufacturing a head gimbal assembly Public/Granted day:2009-01-29
Information query
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