Invention Grant
- Patent Title: Modular footwear system
- Patent Title (中): 模块化鞋类系统
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Application No.: US11748429Application Date: 2007-05-14
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Publication No.: US07984569B2Publication Date: 2011-07-26
- Inventor: Brian Chaney , Don Reardon , John Chaney
- Applicant: Brian Chaney , Don Reardon , John Chaney
- Applicant Address: US OR Portland
- Assignee: Omni Trax Technology, Inc.
- Current Assignee: Omni Trax Technology, Inc.
- Current Assignee Address: US OR Portland
- Agency: Ganz Law, PC
- Main IPC: A43B3/25
- IPC: A43B3/25
Abstract:
A modular sole assembly system for footwear and components thereof.
Public/Granted literature
- US20070227039A1 MODULAR FOOTWEAR SYSTEM Public/Granted day:2007-10-04
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