Invention Grant
- Patent Title: Die assembly for molding of glass element
- Patent Title (中): 用于模制玻璃元件的模具组件
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Application No.: US12162583Application Date: 2007-01-29
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Publication No.: US07984626B2Publication Date: 2011-07-26
- Inventor: Ryuji Tanaka , Toshiyuki Takagi , Toshihisa Kamano , Isao Matsuzuki
- Applicant: Ryuji Tanaka , Toshiyuki Takagi , Toshihisa Kamano , Isao Matsuzuki
- Applicant Address: JP Tokyo-To
- Assignee: Toshiba Kikai Kabushiki Kaisha
- Current Assignee: Toshiba Kikai Kabushiki Kaisha
- Current Assignee Address: JP Tokyo-To
- Agency: DLA Piper LLP US
- Priority: JP2006-020599 20060130
- International Application: PCT/JP2007/051386 WO 20070129
- International Announcement: WO2007/086558 WO 20070802
- Main IPC: B29D11/00
- IPC: B29D11/00 ; C03B11/00 ; C03B11/06 ; C03B11/08

Abstract:
In the initial stage of die-opening operation when an upper core 3 moves upward together with an upper die plate 1, an upper cavity die 2 is biased downwardly by an elastic member 10 so as to press the lower surface of the upper cavity die 2 against the upper surface of a lower cavity die 6 and keep their contact, thereby forcing a molded glass element 4 to remain on a lower core 5 by utilizing the difference in outside diameter between the lower core 5 and the upper core 3. This makes it possible to securely release the molded glass element 4 from the upper core 3 and leave the molded product on the lower core 5 upon die opening, enabling smooth removal and automated transportation of the molded product.
Public/Granted literature
- US20090025430A1 DIE ASSEMBLY FOR MOLDING OF GLASS ELEMENT Public/Granted day:2009-01-29
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