Invention Grant
- Patent Title: Adhesive tape cutting method and adhesive tape joining apparatus using the same
- Patent Title (中): 胶带切割方法和使用其的胶带接合装置
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Application No.: US11898831Application Date: 2007-09-17
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Publication No.: US07984737B2Publication Date: 2011-07-26
- Inventor: Masayuki Yamamoto , Saburo Miyamoto
- Applicant: Masayuki Yamamoto , Saburo Miyamoto
- Applicant Address: JP Osaka
- Assignee: Nitto Denko Corporation
- Current Assignee: Nitto Denko Corporation
- Current Assignee Address: JP Osaka
- Agency: Cheng Law Group, PLLC
- Priority: JP2006-254256 20060920
- Main IPC: B26D5/00
- IPC: B26D5/00
Abstract:
In a state that a reference plane of a cutter holder, to which a cutter blade is attached, is brought into contact with a surface of a base of a supporting adhesive tape, the cutter blade cuts the supporting adhesive tape while the reference plane of the cutter holder follows the surface of the base. Herein, a cutting edge of the cutter blade passes by a joining interface between the supporting adhesive tape and a ring frame without penetrating through an adhesive layer of the supporting adhesive tape.
Public/Granted literature
- US20080066869A1 Adhesive tape cutting method and adhesive tape joining apparatus using the same Public/Granted day:2008-03-20
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