Invention Grant
- Patent Title: Micro electromechanical system connector and method for manufacturing same
- Patent Title (中): 微机电系统连接器及其制造方法
-
Application No.: US12730249Application Date: 2010-03-24
-
Publication No.: US07985075B2Publication Date: 2011-07-26
- Inventor: Jen-Tsorng Chang
- Applicant: Jen-Tsorng Chang
- Applicant Address: TW Tu-Cheng, New Taipei
- Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: TW Tu-Cheng, New Taipei
- Agent Raymond J. Chew
- Priority: CN200910305886 20090821
- Main IPC: H01R12/00
- IPC: H01R12/00

Abstract:
A micro electromechanical system connecter includes a u-shaped plug connecter and a socket connector. The plug connecter includes two opposite substrates and a spacing element sandwiched therebetween and positioned at one ends of the two substrates. Two parallel grooves are defined in outer surfaces of the two substrates at the other ends the two substrates. A plurality of parallel first electrodes formed on the outer surfaces of the two substrates and configured to extend along a direction perpendicular to grooves. The socked connecter includes a base having a top surface. A recess is defined in the top surface. Two protrusions are respectively formed on two internal walls of the recess adjacent to the entrance of the recess. A plurality of parallel second electrodes formed on the base according to the first electrodes. Each second electrode extends from the top surface of the base to one of the two internal walls of the recess.
Public/Granted literature
- US20110045678A1 MICRO ELECTROMECHANICAL SYSTEM CONNECTOR AND METHOD FOR MANUFACTURING SAME Public/Granted day:2011-02-24
Information query