Invention Grant
- Patent Title: Electrode junction structure and manufacturing method thereof
- Patent Title (中): 电极结结构及其制造方法
-
Application No.: US12644571Application Date: 2009-12-22
-
Publication No.: US07985078B2Publication Date: 2011-07-26
- Inventor: Kentaro Kumazawa , Masahiro Ono , Yoshihiro Tomura
- Applicant: Kentaro Kumazawa , Masahiro Ono , Yoshihiro Tomura
- Applicant Address: JP Osaka
- Assignee: Panasonic Corporation
- Current Assignee: Panasonic Corporation
- Current Assignee Address: JP Osaka
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JP2008-329294 20081225
- Main IPC: H01R12/00
- IPC: H01R12/00

Abstract:
The electrode junction structure includes: a glass substrate; a plurality of flexible substrates, in a planar view, arranged to cross over an edge of the glass substrate and arranged to have a space from each other along the edge; an adhesive for joining the glass substrate and each flexible substrate; and a sealing resin for covering junction portions between the glass substrate and each flexible substrate, wherein an edge of the sealing resin is formed so that the edge of the sealing resin has, in the planar view, a consecutive waveform portion in which a convex portion and a concave portion alternate with an imaginary line as a center axis, the imaginary line being parallel to the edge of the glass substrate and locating outer than the edge of the glass substrate, and wherein the convex portions are formed to be located on the flexible substrates.
Public/Granted literature
- US20100167597A1 ELECTRODE JUNCTION STRUCTURE AND MANUFACTURING METHOD THEREOF Public/Granted day:2010-07-01
Information query