Invention Grant
US07985121B2 Chemical-mechanical planarization pad having end point detection window
有权
具有端点检测窗口的化学机械平面化垫
- Patent Title: Chemical-mechanical planarization pad having end point detection window
- Patent Title (中): 具有端点检测窗口的化学机械平面化垫
-
Application No.: US12179359Application Date: 2008-07-24
-
Publication No.: US07985121B2Publication Date: 2011-07-26
- Inventor: Paul Lefevre , Oscar K. Hsu , David Adam Wells , John Erik Aldeborgh , Marc C. Jin
- Applicant: Paul Lefevre , Oscar K. Hsu , David Adam Wells , John Erik Aldeborgh , Marc C. Jin
- Applicant Address: US MA Peabody
- Assignee: Innopad, Inc.
- Current Assignee: Innopad, Inc.
- Current Assignee Address: US MA Peabody
- Agency: Grossman, Tucker, Perreault & Pfleger, PLLC
- Main IPC: B24B49/12
- IPC: B24B49/12
Abstract:
A chemical mechanical polishing pad. The pad includes a surface and a polymer matrix capable of transmitting at least a portion of incident radiation. In addition, at least one embedded structure in the polymer matrix, including a portion of the pad where the embedded structure is not present, and a window integral to the pad defined by the portion of the pad where the embedded structure is not present.
Public/Granted literature
- US20090142989A1 Chemical-Mechanical Planarization Pad Having End Point Detection Window Public/Granted day:2009-06-04
Information query
