Invention Grant
- Patent Title: Using cell voltage as a monitor for deposition coverage
- Patent Title (中): 使用电池电压作为监测器进行沉积覆盖
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Application No.: US12012656Application Date: 2008-02-04
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Publication No.: US07985328B2Publication Date: 2011-07-26
- Inventor: Yang Cao , Yue Ma , Jir-shyr Chen , Rajiv Rastogi
- Applicant: Yang Cao , Yue Ma , Jir-shyr Chen , Rajiv Rastogi
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Blakely, Sokoloff, Taylor & Zafman LLP
- Main IPC: G01N27/27
- IPC: G01N27/27
Abstract:
A method and apparatus are described that use cell voltage and/or current as monitor to prevent electrochemical deposition (e.g., electroplating) tools from deplating wafers with no or poor metal (e.g., Cu) seed coverage.
Public/Granted literature
- US20080142363A1 Using cell voltage as a monitor for deposition coverage Public/Granted day:2008-06-19
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