Invention Grant
- Patent Title: Stiffener sheet and flexible printed circuit board using the same
- Patent Title (中): 加强板和柔性印刷电路板使用相同
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Application No.: US12144260Application Date: 2008-06-23
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Publication No.: US07985482B2Publication Date: 2011-07-26
- Inventor: Yung-Wei Lai , Cheng-Wei Kuo , Shing-Tza Liou
- Applicant: Yung-Wei Lai , Cheng-Wei Kuo , Shing-Tza Liou
- Applicant Address: TW Tayuan, Taoyuan
- Assignee: Foxconn Advanced Technology Inc.
- Current Assignee: Foxconn Advanced Technology Inc.
- Current Assignee Address: TW Tayuan, Taoyuan
- Agent Andrew C. Cheng
- Priority: TW97105339A 20080215
- Main IPC: B32B27/08
- IPC: B32B27/08 ; B32B27/34
Abstract:
A stiffener sheet for flexible printed flexible printed circuit boards, includes alternately laminated polyimide layers and polyamideimide layers, wherein a molecular structure of the polyamideimide is represented by the following formula: wherein Ar and Ar′ represents different substituted aromatic groups.
Public/Granted literature
- US20090205855A1 STIFFENER SHEET AND FLEXIBLE PRINTED CIRCUIT BOARD USING THE SAME Public/Granted day:2009-08-20
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