Integrated circuit package system with contoured encapsulation

Invention Grant

US07985623B2 Integrated circuit package system with contoured encapsulation 有权

Title translation: 具有轮廓封装的集成电路封装系统

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Patent Title: Integrated circuit package system with contoured encapsulation
Patent Title (中): 具有轮廓封装的集成电路封装系统
Application No.: US11735397

Application Date: 2007-04-13
Publication No.: US07985623B2

Publication Date: 2011-07-26
Inventor: Choong Bin Yim , Young Cheol Kim
Applicant: Choong Bin Yim , Young Cheol Kim
Applicant Address: SG Singapore
Assignee: Stats Chippac Ltd.
Current Assignee: Stats Chippac Ltd.
Current Assignee Address: SG Singapore
Agent Mikio Ishimaru
Main IPC: H01L21/44
IPC: H01L21/44

Integrated circuit package system with contoured encapsulation

Abstract:

An integrated circuit package system is provided including providing a carrier, mounting an integrated circuit die on the carrier, connecting the integrated circuit die with the carrier, and forming an encapsulation having a multi-sloped side over the integrated circuit die for reducing ejection stress.

Abstract(Chinese):

提供一种集成电路封装系统，包括提供载体，在载体上安装集成电路管芯，将集成电路管芯与载体连接，以及在集成电路管芯上形成具有多倾斜侧的封装以减少喷射应力。

Public/Granted literature

US20070262473A1 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH CONTOURED ENCAPSULATION Public/Granted day:2007-11-15

Information query

Espacenet

IPC分类:

H	电学
H01	基本电气元件
H01L	半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L21/00	专门适用于制造或处理半导体或固体器件或其部件的方法或设备
H01L21/02	.半导体器件或其部件的制造或处理
H01L21/04	..至少具有一个跃变势垒或表面势垒的器件，例如PN结、耗尽层、载体集结层
H01L21/34	...具有H01L21/06，H01L21/16及H01L21/18各组不包含的或有或无杂质，例如掺杂材料的半导体的器件
H01L21/44	....用H01L21/36至H01L21/428各组不包含的方法或设备在半导体材料上制造电极的