Invention Grant
- Patent Title: Thermal intermediate apparatus, systems, and methods
- Patent Title (中): 热中间设备，系统和方法
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Application No.: US12277075Application Date: 2008-11-24
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Publication No.: US07985627B2Publication Date: 2011-07-26
- Inventor: Bryan M. White , Paul A. Koning , Yuegang Zhang , C. M. Garner
- Applicant: Bryan M. White , Paul A. Koning , Yuegang Zhang , C. M. Garner
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwegman, Lundberg & Woessner, P.A.
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
Apparatus and system, as well as fabrication methods therefor, may include a thermal intermediate structure comprised of a plurality of carbon nanotubes some of which have organic moieties attached thereto to tether the nanotubes to at least one of a die and a heat sink. The organic moieties include thiol linkers and amide linkers.
Public/Granted literature
- US20090075430A1 THERMAL INTERMEDIATE APPARATUS, SYSTEMS, AND METHODS Public/Granted day:2009-03-19
Information query
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