Invention Grant
US07985633B2 Embedded DRAM integrated circuits with extremely thin silicon-on-insulator pass transistors
有权
嵌入式DRAM集成电路,具有极薄的绝缘体上硅传导晶体管
- Patent Title: Embedded DRAM integrated circuits with extremely thin silicon-on-insulator pass transistors
- Patent Title (中): 嵌入式DRAM集成电路,具有极薄的绝缘体上硅传导晶体管
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Application No.: US11929943Application Date: 2007-10-30
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Publication No.: US07985633B2Publication Date: 2011-07-26
- Inventor: Jin Cai , Josephine Chang , Leland Chang , Brian L. Ji , Steven John Koester , Amlan Majumdar
- Applicant: Jin Cai , Josephine Chang , Leland Chang , Brian L. Ji , Steven John Koester , Amlan Majumdar
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agent Vazken Alexanian; Michael J. Chang, LLC
- Main IPC: H01L21/84
- IPC: H01L21/84

Abstract:
Integrated circuits having combined memory and logic functions are provided. In one aspect, an integrated circuit is provided. The integrated circuit comprises: a substrate comprising a silicon layer over a BOX layer, wherein a select region of the silicon layer has a thickness of between about three nanometers and about 20 nanometers; at least one eDRAM cell comprising: at least one pass transistor having a pass transistor source region, a pass transistor drain region and a pass transistor channel region formed in the select region of the silicon layer; and a capacitor electrically connected to the pass transistor.
Public/Granted literature
- US20090108314A1 Embedded DRAM Integrated Circuits With Extremely Thin Silicon-On-Insulator Pass Transistors Public/Granted day:2009-04-30
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