Invention Grant
- Patent Title: Method of forming polycrystalline silicon thin film and method of manufacturing thin film transistor using the method
- Patent Title (中): 使用该方法形成多晶硅薄膜的方法和制造薄膜晶体管的方法
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Application No.: US12045932Application Date: 2008-03-11
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Publication No.: US07985665B2Publication Date: 2011-07-26
- Inventor: Dong-byum Kim , Se-jin Chung
- Applicant: Dong-byum Kim , Se-jin Chung
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: Innovation Counsel LLP
- Priority: KR10-2005-0076347 20050819
- Main IPC: H01L21/20
- IPC: H01L21/20 ; H01L21/36

Abstract:
Provided is a method of forming a polycrystalline silicon thin film with improved electrical characteristics. The method includes forming an amorphous silicon thin film on a substrate, partially melting a portion of the amorphous silicon thin film by irradiating the portion of the amorphous silicon thin film with a laser beam having a low energy density, forming polycrystalline silicon grains with a predetermined crystalline arrangement by crystallizing the partially molten portion of the amorphous silicon thin film, completely melting a portion of the polycrystalline silicon grains and a portion of the amorphous silicon thin film by irradiation of a laser beam having a high energy density while repeatedly moving the substrate by a predetermined distance, and growing the polycrystalline silicon grains by crystallizing the completely molten silicon homogeneously with the predetermined crystalline arrangement.
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